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TPA2080D1
www.ti.com.cn
ZHCS767A– JANUARY2012– – REVISEDOCTOBER2012
BOOSTCONVERTERAUTOPASSTHROUGH(APT)
TheTPA2080D1consistsofaClass-GboostconverterandaClass-Damplifier.Theboostconverteroperates
fromthesupplyvoltage,VBAT,andgeneratesahigheroutputvoltagePVDDat5.75V.PVDDdrivesthesupply
voltageoftheClass-Damplifier.Thisimprovesloudnessovernon-boostedsolutions.Theboostconverterhasa
“Pass Through” ” modeinwhich h itturnsoff automaticallyandPVDDis directly connectedto VBAT T throughan
internalbypassswitch.
Theboostconverterisadaptiveandoperatesbetweenpassthroughmodeandboostmodedependingonthe
output audio signal amplitude. When the e audio o output amplitude e exceeds s the e “auto o pass s through” ” (APT)
threshold,theboostconverterisactivatedautomaticallyandgoestoboostmode.Thetransitiontimefromnormal
mode to boost t mode e is fast t enough h to prevent clipping large transient t audio o signals. . TPA2080D1’s APT
threshold is fixed d at 2 V
PEAK
. When n the audio output signal is below w APT T threshold, , the boost converter is
deactivatedandgoestopassthroughmode.Theadaptiveboostconvertermaximizessystemefficiencyatlower
audiooutputlevels.
TheClass-GboostconverterisdesignedtodrivetheClass-Damplifieronly.Donotusetheboostconverterto
driveexternaldevices.
Figure20showshowtheadaptiveboostconverterbehaveswithatypicalaudiosignal.
spacer
Figure20.Class-GBoostConverterwithTypicalMusicPlayback
Copyright©2012,TexasInstrumentsIncorporated
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L
BOOST
VBAT
(PVDD
VBAT)
L=
I
PVDD
 
L
PVDD
PVDD
I =I
VBAT
0.8
TPA2080D1
ZHCS767A– JANUARY2012– REVISEDOCTOBER2012
www.ti.com.cn
BOOSTCONVERTERCOMPONENTSECTION
Thecriticalexternalcomponentsaresummarizedinthefollowingtable:
PARAMETER
TESTCONDITIONS
MIN
TYP MAX
UNIT
Boostconverterinductor
At30%ratedDCbiascurrentoftheinductor
1.5
2.2
4.7
µ H
Boostconverterinput
4.7
10
µ F
capacitor
Boostconverteroutput
Workingcapacitancebiasedatboostoutputvoltage,if4.7µ Hinductorischosen,
4.7
22
µ F
capacitor
thenminimumcapacitanceis10µ F
BoostTerms
Thefollowingisalistoftermsanddefinitionsusedintheboostequationsfoundlaterinthisdocument.
C
MinimumboostcapacitancerequiredforagivenripplevoltageonPVDD.
L
Boostinductor
f
BOOST
Switchingfrequencyoftheboostconverter.
I
PVDD
CurrentpulledbytheClass-Damplifierfromtheboostconverter.
I
L
Averagecurrentthroughtheboostinductor.
PVDD
SupplyvoltagefortheClass-Damplifier.(Voltagegeneratedbytheboostconverteroutput)
VBAT
SupplyvoltagetotheIC.
Δ
I
L
Ripplecurrentthroughtheinductor.
Δ
V
RipplevoltageonPVDD.
InductorEquations
Inductor current t rating g is determined by y the e requirements of f the e load. The inductance is determined by y two
factors:theminimumvaluerequiredforstabilityandthemaximumripplecurrentpermittedintheapplication.Use
Equation1todeterminetherequiredcurrentrating.Equation1showstheapproximaterelationshipbetweenthe
average inductor r current, I
L
, to the e load d current, load d voltage, , and d input t voltage e (I
PVDD
, PVDD, and d VBAT,
respectively).InsertI
PVDD
,PVDD,andVBATintoEquation1andsolveforI
L
.Theinductormustmaintainatleast
90%ofitsinitialinductancevalueatthiscurrent.
(1)
Ripplecurrent,
Δ
I
L
,ispeak-to-peakvariationininductorcurrent.Smallerripplecurrentreducescorelossesinthe
inductorandreducesthepotentialforEMI.UseEquation2todeterminethevalueoftheinductor,L.Equation2
showstherelationshipbetweeninductanceL,VBAT,PVDD,theswitchingfrequency,f
BOOST
,and
Δ
I
L
.Insertthe
maximumacceptableripplecurrentintoEquation2andsolveforL.
(2)
Δ
I
L
isinverselyproportionaltoL.Minimize
Δ
I
L
asmuchasisnecessaryforaspecificapplication.Increasethe
inductancetoreducetheripplecurrent.Donotusegreaterthan4.7
μ
H,asthispreventstheboostconverter
from responding to o fast output current changes properly. If using above e 3.3 3 µ H, , then n use at least 10 µ µ F
capacitanceonPVDDtoensureboostconverterstability.
ThetypicalinductorvaluerangefortheTPA2080D1is2.2
μ
Hto3.3µ H.Selectaninductorwithlessthan0.5
dcresistance,DCR.HigherDCRreducestotalefficiencyduetoanincreaseinvoltagedropacrosstheinductor.
12
Copyright©2012,TexasInstrumentsIncorporated
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x x
c
I I
1
f =
2
RC
PVDD
BOOST
I
(PVDD
VBAT)
C=1.5
V
PVDD
 
TPA2080D1
www.ti.com.cn
ZHCS767A– JANUARY2012– – REVISEDOCTOBER2012
Table1.SampleInductors
DCR
L
SIZE
I
SAT
MAX
SUPPLIER
COMPONENTCODE
TYP
CRANGE
(µ H)
(LxWxHmm)
(A)
(m
Ω
)
2.2
ChilisinElectronicsCorp.
CLCN252012T-2R2M-N
2.5x2.0x1.2
105
1.2
10-22µ F/16V
2.2
Toko
1239AS-H-2R2N=P2
2.5x2.0x1.2
96
2.3
10-22µ F/10V
2.2
Coilcraft
XFL4020-222MEC
4.0x4.0x2.15
22
3.5
3.3
Toko
1239AS-H-3R3N=P2
2.5x2.0x1.2
160
2.0
10-22µ F/10V
3.3
Coilcraft
XFL4020-332MEC
4.0x4.0x2.15
35
2.8
BoostConverterCapacitorSelection
Thevalueoftheboostcapacitorisdeterminedbytheminimumvalueofworkingcapacitancerequiredforstability
andthemaximumvoltagerippleallowedonPVDDintheapplication.Workingcapacitancereferstotheavailable
capacitanceafterderatingthecapacitorvalueforDCbias,temperature,andaging.Donotuseanycomponent
with a working capacitance less than 6.8 µ µ F. . This corresponds to a 10
μ
F/16 V capacitor or a 10
μ
F/10 V
capacitor.
Donotuseabove22
μ
Fcapacitanceasitwillreducetheboostconverterresponsetimetolargeoutputcurrent
transients.
Equation3showstherelationshipbetweentheboostcapacitance,C,toloadcurrent,loadvoltage,ripplevoltage,
inputvoltage,andswitchingfrequency(I
PVDD
,PVDD,
Δ
V,VBAT,andf
BOOST
respectively).
Insert the maximum m allowed d ripple e voltage into Equation 3 and solve e for r C. . The e 1.5 multiplier accounts s for
capacitancelossduetoapplieddcvoltageandtemperatureforX5RandX7Rceramiccapacitors.
(3)
COMPONENTSLOCATIONANDSELECTION
DecouplingCapacitors
TheTPA2080D1isahigh-performanceClass-Daudioamplifierthatrequiresadequatepowersupplydecoupling.
Adequatepowersupplydecouplingtoensuresthattheefficiencyishighandtotalharmonicdistortion(THD)is
low.
Placealowequivalent-series-resistance(ESR)ceramiccapacitor,typically0.1µ F,within2mmoftheVBATball.
Use X5R andX7R ceramic capacitors. This choice of f capacitor r and placement helps with higher frequency
transients, spikes, or digital hash on n the line. Additionally, placing g this s decoupling g capacitor close e to the
TPA2080D1isimportant,asanyparasiticresistanceorinductancebetweenthedeviceandthecapacitorcauses
efficiencyloss.Inadditiontothe0.1
μ
Fceramiccapacitor,placea2.2µ Fto10µ FcapacitorontheVBATsupply
trace. This larger capacitor acts as a charge reservoir, providing energy y faster r than n the e board supply, , thus
helpingtopreventanydroopinthesupplyvoltage.
InputCapacitors
InputaudioDCdecouplingcapacitorsarerecommended.TheinputcapacitorsandTPA2080D1inputimpedance
formahigh-passfilterwiththecornerfrequency,f
C
,determinedinEquation4.
Anymismatchincapacitancebetweenthetwoinputswillcauseamismatchinthecornerfrequencies.Severe
mismatchmayalsocauseturn-onpopnoise.Choosecapacitorswithatoleranceof±10% orbetter.UseX5R
andX7Rceramiccapacitors.
(4)
Copyright©2012,TexasInstrumentsIncorporated
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TPA2080D1
ZHCS767A– JANUARY2012– REVISEDOCTOBER2012
www.ti.com.cn
SHORTCIRCUITAUTO-RECOVERY
Whenashortcircuiteventhappens,theTPA2080D1goestolowdutycyclemodeandtriestoreactivateitself
every1.6seconds.Theauto-recoverywillcontinueuntiltheshortcircuiteventstops.Thisfeatureprotectsthe
devicewithoutaffectingthedevice'slongtermreliability.
THERMALPROTECTION
ItisimportanttooperatetheTPA2080D1attemperatureslowerthanitsmaximumoperatingtemperature.The
maximumambienttemperaturedependsontheheat-sinkingabilityofthePCBsystem.Given
θ
JA
of97.3°C/W,
themaximumallowablejunctiontemperatureof150° C,andtheinternaldissipationof0.5Wfor1.9W,8
Ω
load,
3.6Vsupply,themaximumambienttemperatureiscalculatedas:
T
A,MAX
=T
J,MAX
θ
JA
P
D
=150° C– – (97.3° ° C/W× × 0.5W)=101.4°C
Thecalculatedmaximumambienttemperatureis101.4°Catmaximumpowerdissipationat3.6Vsupplyand8
Ω
load.TheTPA2080D1isdesignedwiththermalprotectionthatturnsthedeviceoffwhenthejunctiontemperature
surpasses150°CtopreventdamagetotheIC.
OPERATIONWITHDACSANDCODECS
Largenoisevoltagescanbepresentattheoutputof
ΔΣ
DACsandCODECs,justabovetheaudiofrequency
(e.g:80kHzwitha300mV
P-P
).Thisout-of-bandnoiseisduetothenoiseshapingofthedelta-sigmamodulator
intheDAC.SomeClass-DamplifiershavehigheroutputnoisewhenusedincombinationwiththeseDACsand
CODECs. This is because out-of-band noise from m the CODEC/DAC C mixes with the Class-D switching
frequenciesintheaudioamplifierinputstage.TheTPA2080D1hasabuilt-inlow-passfilterwithcutofffrequency
at55kHzthatreducestheout-of-bandnoiseandRFnoise,filteringout-of-bandfrequenciesthatcoulddegrade
in-bandnoiseperformance.IfdrivingtheTPA2080D1inputwith4th-orderorhigher
ΔΣ
DACsorCODECs,add
anR-Clowpassfilterateachoftheaudioinputs(IN+andIN-)oftheTPA2080D1toensurebestperformance.
Therecommendedresistorvalueis100
Ω
andthecapacitorvalueof47nF.
SPEAKERLOADLIMITATION
Speakers are non-linear loads s with h varying impedance (magnitude and phase) over the audio frequency. . A
portionofspeakerloadcurrentcanflowbackintotheboost converteroutputviatheClass-DoutputH-bridge
high-side device. . This is dependent on the speaker's phase e change e over frequency, and the audio signal
amplitudeandfrequencycontent.Mostportablespeakershavelimitedphasechangeattheresonantfrequency,
typicallynomorethan40or50degrees. Toavoidexcessflow-backcurrent,usespeakerswithlimitedphase
change.Otherwise,flow-backcurrentcoulddrivethePVDDvoltageabovetheabsolutemaximumrecommended
operationalvoltage.
ConfirmproperoperationbyconnectingthespeakertotheTPA2080D1anddrivingitatmaximumoutputswing.
ObservethePVDDvoltagewithanoscilloscope.IntheunlikelyeventthePVDDvoltageexceeds6.5V,adda
6.8VZenerdiodebetweenPVDDandgroundtoensuretheTPA2080D1operatesproperly.Theamplifierhas
thermal overloadprotectionanddeactivatesifthedietemperatureexceeds150°C. Itautomaticallyreactivates
oncedietemperaturereturnsbelow150° C.Built-inoutputover-currentprotectiondeactivatestheamplifierifthe
speaker loadbecomes short-circuited. The amplifier automatically restarts 1.6 seconds after the over-current
event.AlthoughtheTPA2080D1Class-DoutputcanwithstandashortbetweenOUT+andOUT-,donotconnect
eitheroutputdirectlytoGND,VDD,orVBATasthiscoulddamagethedevice.
PACKAGEDIMENSIONS
TheTPA2080D1usesa12-ball,0.5mmpitchWCSPpackage.Thedielength(D)andwidth(E)correspondto
thepackagemechanicaldrawingattheendofthedatasheet.
Table2.TPA2080D1YZGPackageDimensions
Dimension
D
E
Max
2012µ m
1560µ m
Typ
1982µ m
1530µ m
Min
1952µ m
1500µ m
14
Copyright©2012,TexasInstrumentsIncorporated
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CopperTrace Width
Solder Pad Width
Solder Mask Opening
CopperTraceThickness
Solder MaskThickness
M0200-01
TPA2080D1
www.ti.com.cn
ZHCS767A– JANUARY2012– – REVISEDOCTOBER2012
BOARDLAYOUT
TPA2080D1hasAGND,BGNDandPGNDforanalogcircuit,boostconverterandClass-Damplifierrespectively.
ThesethreegroundpinsshouldbeconnectedtogetherthroughasolidgroundplanewithmultiplegroundVIAs.
Inmakingthe pad size forthe WCSP balls, itis recommendedthat thelayout usenon-soldermask defined
(NSMD)land. Withthismethod,the solder maskopeningis madelarger thanthe desiredlandarea,andthe
openingsizeisdefinedbythecopperpadwidth.Figure21showstheappropriatediametersforaWCSPlayout.
Figure21. LandPatternDimensions
Table3.LandPatternDimensions
(1) (2) (3) (4)
SOLDERPAD
COPPER
SOLDERMASK
(5)
COPPER
STENCIL
(6) (7)
STENCIL
DEFINITIONS
PAD
OPENING
THICKNESS
OPENING
THICKNESS
Nonsoldermask
275
μ
m
275
μ
mx275
μ
mSq.
375
μ
m(+0.0,-25
μ
m)
1ozmax(32
μ
m)
125
μ
mthick
defined(NSMD)
(+0.0,-25
μ
m)
(roundedcorners)
(1) CircuittracesfromNSMDdefinedPWBlandsshouldbe75
μ
mto100
μ
mwideintheexposedareainsidethesoldermaskopening.
Widertracewidthsreducedevicestandoffandimpactreliability.
(2) BestreliabilityresultsareachievedwhenthePWBlaminateglasstransitiontemperatureisabovetheoperatingtherangeofthe
intendedapplication.
(3) RecommendsolderpasteisType3orType4.
(4) ForaPWBusingaNi/Ausurfacefinish,thegoldthicknessshouldbeless0.5mmtoavoidareductioninthermalfatigueperformance.
(5) Soldermaskthicknessshouldbelessthan20
μ
montopofthecoppercircuitpattern
(6) Bestsolderstencilperformanceisachievedusinglasercutstencilswithelectropolishing.Useofchemicallyetchedstencilsresultsin
inferiorsolderpastevolumecontrol.
(7) TraceroutingawayfromWCSPdeviceshouldbebalancedinXandYdirectionstoavoidunintentionalcomponentmovementdueto
solderwettingforces.
Copyright©2012,TexasInstrumentsIncorporated
15
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TPA2080D1
ZHCS767A– JANUARY2012– REVISEDOCTOBER2012
www.ti.com.cn
REVISIONHISTORY
ChangesfromOriginal(January2012)toRevisionA
Page
将特性从:采用
1.53mmx1.98mm
0.5mm
焊球间距
12
焊球
WCSP
封装改为:采用
1.53mmx1.98mm
0.5mm
焊球间距
12
焊球
WCSP(DSBGA)
封装
.............................................................................................................................. 1
• Added(DSBGA)tothePackagedDevicesoftheORDERINGINFORMATIONtable......................................................... 3
16
Copyright©2012,TexasInstrumentsIncorporated
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type
Package
Drawing
Pins
Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Top-Side Markings
(4)
Samples
TPA2080D1YZGR
ACTIVE
DSBGA
YZG
12
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TPA2080D1
TPA2080D1YZGT
ACTIVE
DSBGA
YZG
12
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TPA2080D1
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD:  The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based  die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br)  and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPEANDREELINFORMATION
*Alldimensionsarenominal
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1(mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TPA2080D1YZGR
DSBGA
YZG
12
3000
180.0
8.4
1.63
2.08
0.69
4.0
8.0
Q1
TPA2080D1YZGT
DSBGA
YZG
12
250
180.0
8.4
1.63
2.08
0.69
4.0
8.0
Q1
PACKAGEMATERIALSINFORMATION
www.ti.com
17-Jun-2015
PackMaterials-Page1
*Alldimensionsarenominal
Device
PackageType
PackageDrawing
Pins
SPQ
Length(mm)
Width(mm)
Height(mm)
TPA2080D1YZGR
DSBGA
YZG
12
3000
182.0
182.0
20.0
TPA2080D1YZGT
DSBGA
YZG
12
250
182.0
182.0
20.0
PACKAGEMATERIALSINFORMATION
www.ti.com
17-Jun-2015
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Documents you may be interested
Documents you may be interested