www.ti.com
RESETINPUT
CALCULATINGJUNCTIONTEMPERATURE
P
D
r
DS(on)
I
2
T
J

P
D
R
JA
T
A
where:
R
qJA
is the inverse of the derating factor given in the dissipation rating table.
LOGIC INPUTS AND OUTPUTS
TPS2220A, TPS2223A
TPS2224A, TPS2226A
SLVS428E–MAY2002–REVISEDMSRCH2008
0.1-mF ceramic capacitor. It is strongly recommended that the switched outputs be bypassed with a 0.1-mF (or
larger) ceramiccapacitor; doing so improves theimmunity of the IC toelectrostatic discharge(ESD). Care should
be taken to minimize the inductance of PCB traces between the devices and the load. High switching currents
can produce large negative voltage transients, which forward biases substrate diodes, resulting in unpredictable
performance. Similarly, nopinshould betakenbelow -0.3 V.
To ensurethat cards are ina known state after power brownouts or system initialization, thePC Cards shouldbe
reset at the same time as the host by applying low-impedance paths from xVCC and xVPP terminals to ground.
A low-impedance output state allows discharging of residual voltage remaining on PC Card filter capacitance,
permitting the system (host and PC Cards) to be powered up concurrently. The active low RESET input closes
internal ground switches S1, S4, S7, and S11 with all other switches left open. The TPS2220A, TPS2223A,
TPS2224A, and TPS2226A remain in the low-impedance output state until the signal is de-asserted and further
datais clockedin andlatched. The input serial datacannot be latched duringreset mode. RESET is providedfor
direct compatibility with systems that usean active-low reset voltage supervisor. TheRESET pin has an internal
150-k
pullupresistor.
The switch resistance, r
DS(on)
,is dependent on the junction temperature, T
J
,of the die. The junction temperature
is dependent on both r
DS(on)
and the current through the switch. To calculate T
J
,first find r
DS(on)
from Figure26
throughFigure28, using an initial temperature estimate about 30°C above ambient. Then, calculate the power
dissipationfor eachswitch, usingthe formula:
Next, sum the powerdissipationofall switches andcalculate thejunctiontemperature:
Compare the calculated junction temperature with the initial temperature estimate. If the temperatures are not
withinafewdegreesof eachother, recalculateusing thecalculatedtemperatureastheinitial estimate.
The serial interface consists of the DATA, CLOCK, and LATCH leads. The data is clocked in on the positive
edge of the clock (seeFigure2). The 11-bit (D0-D10) serial data word is loaded during the positive edge of the
latchsignal. The positive edge of thelatchsignal shouldoccurbefore thenext positive edgeof theclockoccurs.
Theserial interfaceof the deviceis compatiblewithserial-interfacePCMCIA controllers.
An overcurrent output (OC) is provided to indicate an overcurrent or overtemperature condition in any of the
xVCC andxVPPoutputs aspreviouslydiscussed.
Copyright©2002–2008,TexasInstrumentsIncorporated
SubmitDocumentationFeedback
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ProductFolderLink(s):TPS2220A TPS2223ATPS2224A A TPS2226A
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type
Package
Drawing
Pins
Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
TPS2220ADBR
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS2220A
TPS2220APWP
ACTIVE
HTSSOP
PWP
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPS2220A
TPS2220APWPR
ACTIVE
HTSSOP
PWP
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPS2220A
TPS2220APWPRG4
ACTIVE
HTSSOP
PWP
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPS2220A
TPS2223ADB
ACTIVE
SSOP
DB
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS2223A
TPS2223ADBG4
ACTIVE
SSOP
DB
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS2223A
TPS2223ADBR
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS2223A
TPS2223APWP
ACTIVE
HTSSOP
PWP
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPS2223A
TPS2223APWPR
ACTIVE
HTSSOP
PWP
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPS2223A
TPS2223APWPRG4
ACTIVE
HTSSOP
PWP
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPS2223A
TPS2224ADB
ACTIVE
SSOP
DB
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS2224A
TPS2224ADBG4
ACTIVE
SSOP
DB
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS2224A
TPS2224ADBR
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS2224A
TPS2224ADBRG4
ACTIVE
SSOP
DB
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS2224A
TPS2224APWP
ACTIVE
HTSSOP
PWP
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPS2224A
TPS2224APWPG4
ACTIVE
HTSSOP
PWP
24
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPS2224A
TPS2224APWPR
ACTIVE
HTSSOP
PWP
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPS2224A
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Addendum-Page 2
Orderable Device
Status
(1)
Package Type
Package
Drawing
Pins
Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
TPS2226ADB
ACTIVE
SSOP
DB
30
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS2226A
TPS2226ADBG4
ACTIVE
SSOP
DB
30
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS2226A
TPS2226ADBR
ACTIVE
SSOP
DB
30
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS2226A
TPS2226ADBRG4
ACTIVE
SSOP
DB
30
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS2226A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD:  The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based  die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br)  and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Addendum-Page 3
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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TAPE ANDREEL INFORMATION
*Alldimensionsarenominal
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1(mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TPS2220ADBR
SSOP
DB
24
2000
330.0
16.4
8.2
8.8
2.5
12.0
16.0
Q1
TPS2220APWPR
HTSSOP
PWP
24
2000
330.0
16.4
6.95
8.3
1.6
8.0
16.0
Q1
TPS2223ADBR
SSOP
DB
24
2000
330.0
16.4
8.2
8.8
2.5
12.0
16.0
Q1
TPS2223APWPR
HTSSOP
PWP
24
2000
330.0
16.4
6.95
8.3
1.6
8.0
16.0
Q1
TPS2224ADBR
SSOP
DB
24
2000
330.0
16.4
8.2
8.8
2.5
12.0
16.0
Q1
TPS2224APWPR
HTSSOP
PWP
24
2000
330.0
16.4
6.95
8.3
1.6
8.0
16.0
Q1
TPS2226ADBR
SSOP
DB
30
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
PackMaterials-Page1
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*Alldimensionsarenominal
Device
PackageType
PackageDrawing
Pins
SPQ
Length(mm)
Width(mm)
Height(mm)
TPS2220ADBR
SSOP
DB
24
2000
367.0
367.0
38.0
TPS2220APWPR
HTSSOP
PWP
24
2000
367.0
367.0
38.0
TPS2223ADBR
SSOP
DB
24
2000
367.0
367.0
38.0
TPS2223APWPR
HTSSOP
PWP
24
2000
367.0
367.0
35.0
TPS2224ADBR
SSOP
DB
24
2000
367.0
367.0
38.0
TPS2224APWPR
HTSSOP
PWP
24
2000
367.0
367.0
38.0
TPS2226ADBR
SSOP
DB
30
2000
367.0
367.0
38.0
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
PackMaterials-Page2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 
DALLAS, TEXAS 75265
DB (R-PDSO-G**)   
PLASTIC SMALL-OUTLINE
4040065/E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,90
7,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
20
16
6,50
6,50
14
0,05 MIN
5,90
5,90
DIM
A  MAX
A  MIN
PINS **
2,00 MAX
6,90
7,50
0,65
M
0,15
0°
8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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